May 31, 2017

Dust-protected booksize PC with Intel Q170 chipset

The system is based on a mini-ITX board with Q170 Intel® chipset and a sixth-generation Intel® Core™ processor from the desktop or low power desktop series (codenamed Skylake). The high-performance Intel® HD510 / HD530 graphics controller is integrated in the powerful processor. The on-board DDR4 SDRAM memory can be expanded to 32 GB via two SO-DIMM sockets.

The robust dust-protected housing of the BookSize B1-Q170 is especially suited for harsh industrial environment. The replaceable fan cartridge facilitates maintenance of the computer.

To ensure a high reliability, the box PC is equipped with proven, high-quality key components. The BookSize is manufactured at MSC Technologies’ factory in Freiburg, which specialises in manufacturing small and large batches flexibly. On customer request, the modular B1-Q170 can be adapted quickly with optimised cost to special application requirements.

The Remote Diagnostic Tool ReDi 1 from MSC Technologies permanently monitors the state of all system-critical operating parameters. This allows possible failures of the robust industrial computer to be detected early – before the failure of individual components – in order to initiate appropriate rectification measures. The objective is to achieve high availability of the systems to eliminate computer downtimes and to support a predictive maintenance.

The BookSize B1-Q170 features numerous industrial interfaces like GbE LAN, USB 3.0, USB 2.0, Serial ATA, HD Audio, and the graphics interfaces DVI-D and 2 x DisplayPort (DP) V1.2. The computer can be equipped with a galvanically isolated GPIO and a CAN bus interface.

The PCI Express™ x16 slot allows the box PC to be expanded flexibly. In addition, one 3.5" exchangeable plug-in unit and optionally two removable SSDs/HDDs are present. The embedded system receives its power from an integrated 250W AC 80 PLUS power supply.