MSC C10 module

The MSC C10M-BT-33E5 features the new Intel Atom CPU platform in a COM express type 10 form factor. Combined with onboard eMMC memory, video output and low power consumption, this computing module will be ideal for portable equipment, POS, medical and industrial applications.
The features include Sata-II, HDMI, dual possible LVDS output, seven USB hosts, Ethernet and PCIe extension.
Software services like Microsoft Embedded OS support and development can be offered with this module. Evaluation kit and baseboard are available as well as baseboard development services.
Model name | C10M-BT |
---|---|
Form factor | COM Express T10 |
Dimensions | 55 x 84mm |
CPU | Intel Atom E3845 1.91GHz Quad Core |
Chipset | Intel Baytrail SoC |
RAM | 4GB |
Onboard storage | 16GB eMMC |
OS support | WES7, Windows 8/8.1, Linux |
Avnet Embedded have built a range of industrial and semi-industrial modules that ensures highest performance, both in regards to reliability and speed.
Our selection of modules are all based on industry standard form factors, such as Mini-ITX, 3.5” & Pico-ITX. By taking advantage of these standards and selecting partners that support extended life time products we are able to provide not only continuous supply of the same board for 5-7 years but also offer direct replacements when the time comes to re-design.
Some of the markets that benefit from this are:
- Industrial Automation Control
- Medical/Healthcare
- Military
- Aerospace
- Digital Signage
- Kiosk
- Broadcast
- Gaming
Our engineering team have supported many customers in these markets in launching new products on industrial modules.
Some typical applications we see for these products:
- Xray machines
- CT scanners
- Live Audio/Video mixing desks
- Robot control
- Industrial data capture and analytics
- Gaming machines
- Intelligent routers
Avnet Embedded also offer additional lifecycle services around these products which many of our customers benefit from, such as:
- Extended warranty – up to 10 years
- Advanced replacement warranties – to ensure the shortest down time possible in the unlikely event of a failure
- Onsite maintenance
- Windows & Linux image creation
- Kitting and integration options
Click here to read more about our services
MSC C10M-BT-20E7 | Intel Celeron J1900 quad-core 2.00/2.42GHz, 2MB L2, 10W TDP, 4GB DDR3 SDRAM, 16GB eMMC, 10/100/1000Base-TX, Type 10 |
MSC C10M-BT-33E5 | Intel Atom E3845 quad-core 1.91GHz, 2MB L2, 10W TDP, 4GB DDR3 ECC SDRAM, 16GB eMMC, TPM, 10/100/1000Base-TX, Type 10 |
MSC C10M-BT-3164 | Intel Atom E3827 dual-core 1.75GHz, 1MB L2, 8W TDP, 4GB DDR3 SDRAM, 4GB eMMC, TPM, 10/100/1000Base-TX, Type 10 |
MSC C10M-BT-2022 | Intel Atom E3825 dual -core 1.33GHz, 1MB L2, 6W TDP, 4GB DDR3 SDRAM, 10/100/1000Base-TX, Type 10 |
MSC C10M-BT-2011 | Intel Atom E3815 single-core 1.46GHz, 512kB L2, 5W TDP, 2GB DDR3 SDRAM, 10/100/1000Base-TX, Type 10 |
MSC C10M-BT-2111 | Intel Atom E3815 single-core 1.46GHz, 512kB L2, 5W TDP, 2GB DDR3 SDRAM, 10/100/1000Base-TX, Type 10 |
Accessories
MSC C10-SK-BT-EV | COM Express Type 10 starterkit for all C10M-BT modules. Uses the new C10-MB-EV platform for type 10 modules (mini-ITX format). Includes suitable heatspreader for C10M-BT modules |
MSC C10-MB-EV-001 | COM Express Type 10 evaluation carrier board with PCI express x4 slot, USB 3.0/2.0, GbE, SATA, DisplayPort, eDP/LVDS and HD audio interfaces, mini PCI express socket, SD card slot, ATX power connector and single 12V power jack. Dimensions: 170mm x 170mm (mini-ITX form factor) |
MSC C10M-BT-01 HSI-001 | Passive heatsink for C10M-BT and C10M-BTC consisting of a single-piece aluminum pin cooler, standoffs without thread (2.8mm inner diameter) and thermopad for thermal contact to SoC. With threaded mounting holes for an optional fan |
MSC C10M-BT-01 HSP-001 | Heatspreader for C10M-BT. Single-piece aluminum profile, standoffs without thread (2.8mm inner diameter) and thermopad for thermal contact to SoC |
MSC C10M-BT-02 HSP-001 | Heatspreader for C10M-BT. Single-piece aluminum profile, standoffs with M2.5 thread and thermopad for thermal contact to SoC |